Substrate for semiconductor apparatus

Details Substrate for semiconductor apparatus Substrate for semiconductor apparatus

1995-01-04

1996-10-08

Picardat, Kevin M.

Fishing, trapping, and vermin destroying

437214, 437217, 437219, H01L 2160

Patent

active

055631010

ABSTRACT:
This invention relates to a substrate for semiconductor apparatus loading a semiconductor chip in an integrated circuit apparatus and is characterized in that a sintered compact containing copper of 2 to 30 wt. % in tungsten and/or molybdenum is used as the substrate having the heat radiation capable of efficiently radiating heat developed from the loaded semiconductor chip and thermal expansion coefficient similar to those of semiconductor chip and other enclosure material except for the substrate.

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