Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask
Reexamination Certificate
2004-03-18
2009-08-25
Huff, Mark F (Department: 1795)
Radiation imagery chemistry: process, composition, or product th
Radiation modifying product or process of making
Radiation mask
C430S011000, C451S041000
Reexamination Certificate
active
07579120
ABSTRACT:
In a reticle substrate is used for forming a reticle held on a stepper and has main surfaces opposing each other, side faces, and chamfered surfaces formed between main surfaces and side faces, a flatness-measuring area is defined as an area excluding a peripheral area of a width of 3 mm inwardly laid from a boundary between the main surface and the chamfered surfaces and has a flatness of 0.5 μm or less, and a maximum height from a reference plane falls between −1 and 0 μm at the boundary between the main surface and the chamfered surface.
REFERENCES:
patent: 2002/0058186 (2002-05-01), Nozawa et al.
patent: 2002/0061452 (2002-05-01), Nozawa et al.
patent: 2002/0155361 (2002-10-01), Takeuchi et al.
patent: 2003/0031890 (2003-02-01), Moriya et al.
patent: 2003/0036340 (2003-02-01), Moriya et al.
patent: 2003/0186624 (2003-10-01), Koike et al.
patent: 10314212 (2003-03-01), None
patent: 1152291 (2001-11-01), None
patent: 1283551 (2003-02-01), None
patent: 64-40267 (1989-02-01), None
patent: 2002-162726 (2002-06-01), None
patent: 2002-318450 (2002-10-01), None
patent: 2003-51472 (2003-02-01), None
patent: 2003315980 (2003-11-01), None
patent: 2004-29735 (2004-01-01), None
patent: 2004-54285 (2004-02-01), None
German Office Action dated, Jun. 20, 2008.
Masamitsu Itoh, et al., New Concept of Specification for Mask Flatness, Proceedings of SPIE Photomask and Next-Generation Lithography Mask Techonology IX, SPIE vol. 4754 (2002), 43-53.
Fraser Stewart A
Hoya Corporation
Huff Mark F
Sughrue & Mion, PLLC
LandOfFree
Substrate for reticle and method of manufacturing the... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Substrate for reticle and method of manufacturing the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate for reticle and method of manufacturing the... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4129606