Substrate for producing semiconductor wafer

Details Substrate for producing semiconductor wafer Substrate for producing semiconductor wafer

1993-11-12

1995-08-08

Ahmad, Nasser

Stock material or miscellaneous articles

Circular sheet or circular blank

Edge structure

428131, 428134, 428135, 428136, 428156, 428167, 428192, B32B 302

Patent

active

054397235

ABSTRACT:
A semiconductor wafer includes a notch or a hole used in preparing an orientation flat on the wafer. The notch in the wafer includes a side that is perpendicular to the surfaces of the wafer and aligned along a cleavage plane of the wafer for forming the orientation flat by cleaving. A hole in a wafer preferably includes an axis aligned along the cleaving plane. A sharp, non-rounded cleavage is formed by preparing the notch or hole after the completion of any etching processes or other steps that may round the edges of the flat. The sharp edges aid in achieving a precision alignment using the orientation flat.

REFERENCES:
patent: 4366198 (1982-12-01), Ramspacher
patent: 4883771 (1989-11-01), Kumabe
patent: 4901328 (1990-02-01), Matsui

Affiliated with

Also associated with

Rating

Substrate for producing semiconductor wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate for producing semiconductor wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate for producing semiconductor wafer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-969953