Substrate for print circuit board, a print circuit board, and me

Details Substrate for print circuit board, a print circuit board, and me Substrate for print circuit board, a print circuit board, and me

1986-09-10

1987-09-01

Swisher, Nancy A.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428446, 428702, 428471, 428901, B32B 1504, B32B 1516, B05D 307, B05D 112

Patent

active

046908552

ABSTRACT:
A substrate for print circuit board comprising a steel sheet, a forsterite film layer formed on at least one surface of the steel sheet, and an insulating film layer formed on the forsterite film layer by baking a coating solution mainly consisting of a phosphate and colloidal silica. A print circuit board having a conductive pattern on the insulating film layer of the substrate for print circuit board, and methods of manufacturing the substrate and the print circuit board. One of typical methods of manufacturing the substrate for print circuit board comprises steps of applying an annealing separator mainly consisting of MgO on the steel sheet and annealing it to form a forsterite film layer, applying and baking a coating solution mainly consisting of the phosphate and colloidal silica onto the forsterite film layer to form an insulating film layer. The print circuit board is obtained by bonding the conductive pattern to the insulating film layer and annealing at a temperature range of not lower than 300.degree. C. but lower than 1,050.degree. C.

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patent: 4273822 (1981-06-01), Bube
patent: 4309485 (1982-01-01), Kondo et al.
patent: 4322478 (1982-03-01), Forsberg
patent: 4510195 (1985-04-01), Iida et al.

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