Substrate for packaging a semiconductor device having particular

Details Substrate for packaging a semiconductor device having particular Substrate for packaging a semiconductor device having particular

1991-01-23

1993-03-23

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257780, H01L 2314, H01L 2354

Patent

active

051967260

ABSTRACT:
A substrate for packaging a semiconductor device having a bump thereon according to the present invention is characterized by that the substrate has an electrode terminal to which the bump is to be connected, the electrode terminal has a recess formed thereon to the receive at least a top of the bump, and at least a top of the surface of the electrode terminal is covered by a metal layer having a lower melting point than that of the bump.

REFERENCES:
patent: 4818728 (1989-04-01), Rai et al.
patent: 4914814 (1990-04-01), Behun et al.
patent: 4940181 (1990-07-01), Juskey et al.
patent: 4998665 (1991-03-01), Hayashi

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