Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2001-10-24
2002-11-19
Cuneo, Kamand (Department: 2827)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S261000, C361S767000, C361S774000
Reexamination Certificate
active
06483042
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to a substrate for mounting a semiconductor integrated circuit device such as a film carrier tape on which a semiconductor integrated circuit device for driving a display panel.
BACKGROUND OF THE INVENTION
COG (Chip On Glass) mounting method and TCP (Tape Carrier Package) mounting method are conventionally known as methods to mount an integrated circuit chip for driving liquid crystal (will be referred to as liquid crystal driver LSI chip) on a liquid crystal display. The COG mounting method is to mount a liquid crystal driver LSI chip directly on a lower glass substrate of a liquid crystal panel.
On the other hand, the TCP mounting method is to mount a liquid crystal driver LSI chip on an insulating film using TCP technique. In this method, the insulating film includes a copper wiring pattern, and a part of the pattern jutting into a device hole section formed on the film is called an inner lead section.
Tips of these inner lead sections are electrically connected to electrodes (bumps) of a liquid crystal driver LSI chip situated in the device hole section. Also, the insulating film includes a copper wiring for electrical connection to the outside, i.e. an outer lead section. A tip of this outer lead section is electrically connected to a liquid crystal panel or a wiring substrate.
For instance, provided that a TCP and a liquid crystal panel are electrically connected, the outer lead section is bonded to ITO (Indium Tin Oxide) terminal on a lower glass substrate of the panel via such as ACF (Anisotropic Conductive Film) by thermocompression.
On account of this, multiple TCP-type liquid crystal driver LSI chips are mounted on a periphery of the liquid crystal panel, and the panel is driven.
FIG. 5
schematically shows a liquid crystal driver LSI chip
101
being mounted on a film carrier tape
102
, to form a TCP. The film carrier tape
102
is formed by setting a predetermined wiring pattern on a band-shaped insulating film carrier tape substrate
103
.
The film carrier tape
102
is torn off along broken line L shown in
FIG. 5
, to form TCP
104
each containing a liquid crystal driver LSI chip
101
.
Since many output terminals are arranged along the output side of the liquid crystal driver LSI chip
101
, the chip looks like an extremely slim rectangle, if viewed from above. Therefore, the liquid crystal driver LSI chip
101
is typically mounted so that its longer side lies across the film carrier tape
102
(in Y direction).
The liquid crystal driver LSI chips
101
are mounted in a single line with a predetermined interval (distance a) between each other along the length (X direction) of the film carrier tape
102
.
On the film carrier tape substrate
103
, input lead sections
105
and output lead sections
106
are formed as the wiring pattern described above, to connect the liquid crystal driver LSI chip
101
to other devices.
The input lead sections
105
are for receiving a signal to the liquid crystal driver LSI chip
101
. The output lead sections
106
are for transmitting a driving signal from the liquid crystal driver LSI chip
101
to a liquid crystal panel.
Furthermore, input test terminals (pads)
107
are formed on tips of the input lead sections
105
. Output test terminals
108
(pads) are formed on tips of the output lead sections
106
.
The input test terminals
107
and the output test terminals
108
are used for making contact with probes of a wafer prober, when the liquid crystal driver LSI chip
101
is examined.
That is to say, when the liquid crystal driver LSI chip
101
is examined, control signals for various testing coming from an external testing device, reference voltages for a gray scale, and power supply of the liquid crystal driver LSI are fed from the probes of the wafer prober to the liquid crystal driver LSI chip
101
via the input test terminals
107
.
Then an output signal (mainly an output signal for driving the liquid crystal panel) from the liquid crystal driver LSI chip
101
is input to the testing device from the output test terminals
108
via the probes of the wafer prober, to examine response characteristics of the output signal and output voltage error.
By doing this, the quality of the liquid crystal driver LSI chip
101
including its condition of mounting on the film carrier tape
102
is judged.
By the way, after the testing, the input test terminals
107
and the output test terminals
108
are cut off from the TCP
104
, when the film carrier tape
102
is torn off along broken line L to obtain the TCPs
104
.
By this cutting-off, tips of the input lead sections
105
and the output lead sections
106
of the TCP
104
become outer lead sections with their solder resists uncovered. The outer lead sections are made to be electrically connected with the liquid crystal panel or other wiring substrates as described above.
Moreover, in the film carrier tape substrate
103
, sprocket holes
109
are made along one edge of the substrate and sprocket holes
110
are also made along the other edge, both at regular intervals. The sprocket holes
109
and
110
are symmetrically located in X direction.
These sprocket holes
109
and
110
are used to transport the film carrier tape substrate
103
by using sprockets, and also to align the liquid crystal driver LSI chip
101
when mounting.
Each liquid crystal driver LSI chip
101
is mounted so that a middle point of line O (connecting in Y direction through centers of both sprocket holes
109
and
110
) and the center of the chip
101
are matched (see the chip
101
on the left side of the figure).
Therefore, in X direction, the liquid crystal driver LSI chips
101
are situated so that a pitch between the chips is an integral multiple of a pitch between the sprocket holes
109
and
110
(distance b in the figure).
The pitch between the sprocket holes
109
and
110
(b in the figure) is set at 4.75 mm by JIS, the Japanese Industrial Standards. So, if the distance from the edge of the input test terminals
107
to the edge of the output test terminals
108
(distance c in the figure) is set at 6.0 mm, one liquid crystal driver LSI chip
101
can be mounted at every two pitches of the sprocket hole
109
and
110
, to accommodate as many chips as possible.
Now, an arrangement of the input test terminals
107
and the output test terminals
108
is described. Since the input lead sections
105
(input test terminals
107
) are fewer than the output lead sections
106
(output test terminals
108
), as
FIG. 5
shows, the input lead sections
105
are arranged in a single line in Y direction.
On the other hand, the number of required output lead sections
106
(output test terminals
108
) in one liquid crystal driver LSI chip
101
is decided in accordance with a number of pixels of the liquid crystal panel corresponding to each color of red, green and blue. For instance, 128×3=384 output lead sections
106
(shown as output
1
to output N in the figure) are required to drive 384 pixels. Thus the output lead sections
106
(output test terminals
108
) are considerably large in number.
Also, as the number of the pixels have increased in accordance with upsizing and improvement of the resolution of the liquid crystal panel, the number of the output lead sections
106
(output test terminals
108
) in one liquid crystal driver LSI chip
101
has been increasing.
Hence if the output test terminals
108
are arranged in a single line in Y direction as
FIG. 5
shows, it is impossible to accommodate all of them within the width of the film carrier tape substrate
103
.
Thus, in practical use the output test terminals
108
are arranged in four tiers in X direction as
FIG. 6
shows. (See
FIG. 27
(Hitachi standard TCP) of “Hitachi LCD Driver LSI Databook”: the sixth edition, published by Applied Technology Sector of Hitachi Microcomputer System Co. Ltd., in March 1992)
In this case, since an area in which the output test terminals
108
are arranged expands in X direction of the film carrier tape
102
, dista
Alcala José H.
Birch & Stewart Kolasch & Birch, LLP
Cuneo Kamand
Sharp Kabushiki Kaisha
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