Substrate for mounting integrated circuit semiconductor chips

Details Substrate for mounting integrated circuit semiconductor chips Substrate for mounting integrated circuit semiconductor chips

1994-03-24

1997-04-15

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Beam leads

257739, 257753, 257784, H01L 2348

Patent

active

056212461

ABSTRACT:
A multichip substrate including a bonding pad, wiring layers insulated by polyimide layers and structure for protecting separation or the polyimide layers from occurring due to water oozing from the polyimide layers by: fabricating posts between the bonding pad and an inorganic insulation layer fabricated on a base substrate through the organic insulation layers by accumulating parts of the wiring layers; and providing holes for setting the water free, around the bonding pad so that the polyimide layer is exposed out of the multichip substrate; or fabricating the bonding pad directly on the inorganic insulation layer, fabricating the polyimide layers and wiring layers in terraced configuration at a periphery of the bonding pad.

REFERENCES:
patent: 5309025 (1994-05-01), Bryant

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