Substrate for mounting IC chip, substrate for motherboard,...

Details Substrate for mounting IC chip, substrate for motherboard,... Substrate for mounting IC chip, substrate for motherboard,...

2006-04-12

2008-10-14

Pak, Sung (Department: 2874)

Optical waveguides

Integrated optical circuit

Reexamination Certificate

active

07437030

ABSTRACT:
The present invention aims to provide a substrate for mounting an IC chip, on which an optical signal passing region is formed and which can suppress a transmission loss in an optical signal and transmit an optical signal more positively with high reliability. The substrate for mounting an IC chip according to the present invention is a substrate for mounting an IC chip, in which a conductor circuit and an insulating layer are laminated in alternate fashion and in repetition on both faces of a substrate and an optical element is mounted on the substrate. Herein, the substrate for mounting an IC chip includes an optical signal passing region, and a microlens arranged on an end portion of the optical signal passing region on the opposite side from the optical element.

REFERENCES:
patent: 5105237 (1992-04-01), Hasegawa et al.
patent: 6330377 (2001-12-01), Kosemura
patent: 6334014 (2001-12-01), Nitta et al.
patent: 6623178 (2003-09-01), Sakurai et al.
patent: 6661939 (2003-12-01), Kaneko et al.
patent: 6788874 (2004-09-01), Ishikawa et al.
patent: 7070207 (2006-07-01), Asai
patent: 2001/0023970 (2001-09-01), Ilda et al.
patent: 2003/0142409 (2003-07-01), Ohtsu et al.
patent: 2005/0185880 (2005-08-01), Asai
patent: 2006/0012967 (2006-01-01), Asai et al.
patent: 1126517 (2001-08-01), None
patent: 62-274679 (1987-11-01), None
patent: 3-290606 (1991-12-01), None
patent: 4-074483 (1992-03-01), None
patent: 5-55633 (1993-03-01), None
patent: 5-211202 (1993-08-01), None
patent: 6-230203 (1994-08-01), None
patent: 6-281831 (1994-10-01), None
patent: 6-326285 (1994-11-01), None
patent: 8-110436 (1996-04-01), None
patent: 9-281352 (1997-10-01), None
patent: 11-12465 (1999-01-01), None
patent: 11-287926 (1999-10-01), None
patent: 2000-66051 (2000-03-01), None
patent: 2000-081524 (2000-03-01), None
patent: 2000-147275 (2000-05-01), None
patent: 2000-199827 (2000-07-01), None
patent: 2000-214351 (2000-08-01), None
patent: 2000-298352 (2000-10-01), None
patent: 2000-321442 (2000-11-01), None
patent: 2000-332301 (2000-11-01), None
patent: 2001-33665 (2001-02-01), None
patent: 2001-042145 (2001-02-01), None
patent: 2001-059923 (2001-03-01), None
patent: 2001-185752 (2001-07-01), None
patent: 2001-278941 (2001-10-01), None
patent: 2001-298052 (2001-10-01), None
patent: 2001-320172 (2001-11-01), None
patent: 2001-339077 (2001-12-01), None
patent: 2002-76376 (2002-03-01), None
patent: 2002-98863 (2002-04-01), None
patent: 2002-107560 (2002-04-01), None
patent: 2002-120230 (2002-04-01), None
patent: 2002-189137 (2002-07-01), None
patent: 2002-329891 (2002-11-01), None
patent: 2002-331532 (2002-11-01), None
patent: 2002329891 (2002-11-01), None
Yuzo Ishii, et al., “Large-Tolerant, OptoBump, Interface for Interchip Optical Interconnections”, IEICE Transactions C, vol. J84-C, No. 9, Sep. 2001, pp. 739-799 (with partial English translation).
Ray T. Chen, et al., “Fully Embedded Board-Level Guided-Wave Optoelectronic Interconnects”, Proceedings of the IEEE, vol. 88, No. 6, Jun. 2000, pp. 780-793.

Affiliated with

Also associated with

Rating

Substrate for mounting IC chip, substrate for motherboard,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate for mounting IC chip, substrate for motherboard,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate for mounting IC chip, substrate for motherboard,... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4000534