Pipe joints or couplings – With leakage or drip disposal – Weep holes
Reexamination Certificate
2006-07-04
2006-07-04
Nelms, David (Department: 2818)
Pipe joints or couplings
With leakage or drip disposal
Weep holes
C257S040000, C257S080000, C257S082000, C257S113000, C385S014000, C385S049000, C385S088000, C385S129000
Reexamination Certificate
active
07070207
ABSTRACT:
The present invention provides a device for optical communication comprising: a substrate for mounting an IC chip having a light emitting element and a light receiving element mounted at predetermined positions; and a multilayered printed circuit board having an optical waveguide formed at a predetermined position, which is low in connection loss among the mounted optical components and which has excellent connection reliability.The device for optical communication according to the present invention comprises the substrate for mounting an IC chip and the multilayered printed circuit board, wherein the substrate for mounting an IC chip includes conductor circuits, interlaminar insulating layers and via-holes for connecting the conductor circuits, with the interlaminar insulating layers interposed therebetween, to each other, and a light receiving element and a light emitting element are mounted on the substrate for mounting an IC chip.
REFERENCES:
patent: 5239189 (1993-08-01), Lawrence
patent: 6330377 (2001-12-01), Kosemura
patent: 6334014 (2001-12-01), Nitta et al.
patent: 2004/0047539 (2004-03-01), Okubora et al.
patent: 1 194 025 (2002-04-01), None
patent: 61-117882 (1986-06-01), None
patent: 5-55633 (1993-03-01), None
patent: 6-69490 (1994-03-01), None
patent: 6-132516 (1994-05-01), None
patent: 6-281831 (1994-10-01), None
patent: 8-330686 (1996-12-01), None
patent: 11-12465 (1999-01-01), None
patent: 11-287926 (1999-10-01), None
patent: 2000-81524 (2000-03-01), None
patent: 2000-147275 (2000-05-01), None
patent: 2000-299562 (2000-10-01), None
patent: 2000-332301 (2000-11-01), None
patent: 2001-57466 (2001-02-01), None
patent: 2001-196643 (2001-07-01), None
patent: 2002-120230 (2002-04-01), None
patent: 2002-1202300 (2002-04-01), None
patent: 2002-236228 (2002-08-01), None
patent: 2002-236229 (2002-08-01), None
patent: 2002-237684 (2002-08-01), None
patent: 2002-250830 (2002-09-01), None
patent: 2002-270860 (2002-09-01), None
patent: 2002-277664 (2002-09-01), None
patent: 2002-289911 (2002-10-01), None
patent: 2002-296435 (2002-10-01), None
patent: 2002-329891 (2002-11-01), None
patent: 2002-331532 (2002-11-01), None
patent: 2003-46021 (2003-02-01), None
patent: 2003-46061 (2003-02-01), None
patent: 2003-46256 (2003-02-01), None
patent: 2003-101080 (2003-04-01), None
patent: 2003-110245 (2003-04-01), None
patent: 2003-215372 (2003-07-01), None
patent: 2004-4426 (2004-01-01), None
patent: 2004-4427 (2004-01-01), None
patent: 2004-4428 (2004-01-01), None
Ibiden Co. Ltd.
Nelms David
Nguyen Dao H.
LandOfFree
Substrate for mounting IC chip, multilayerd printed circuit... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Substrate for mounting IC chip, multilayerd printed circuit..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate for mounting IC chip, multilayerd printed circuit... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3576472