Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate
1998-09-09
2001-03-13
Gaffin, Jeffrey (Department: 2841)
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
C174S260000, C174S261000, C361S780000, C361S783000, C361S764000, C029S832000, C029S835000
Reexamination Certificate
active
06201185
ABSTRACT:
TECHNICAL FIELD
The present invention relates to an electronic parts mounting substrate in which side-surface patterns having a plurality of potentials are disposed on wall surfaces of a mount opening portion for mounting the electronic parts, and a method of manufacturing same.
TECHNICAL BACKGROUND
Conventionally, as shown in
FIG. 27
, an electronic parts mounting substrate having a mount opening portion
95
at which electronic parts
8
are mounted (Japanese Patent Application Laid-Open No. Hei 7-86752) has been known. For example, a plurality of side-surface patterns
901
are disposed on wall surfaces of the mount opening portion
95
. The side-surface patterns
901
are connected to wiring patterns
53
formed inside of the electronic parts mounting substrate
9
.
As shown in
FIGS. 27 and 28
, the electronic parts
8
mounted at the mount opening portion
95
are electrically connected to band-like side-surface pads
903
, disposed above the side-surface patterns
901
, through bonding wires
80
.
Also, wiring patterns
54
, each having a bonding pad
540
at an end thereof, are disposed on an upper surface of the electronic parts mounting substrate
9
. The wiring patterns
54
are connected to through-holes
99
provided in the periphery of the electronic parts mounting substrate
9
. For example, a lead pin
86
is installed inside each of the through-holes
99
.
In manufacturing the above electronic parts mounting substrate, four cut holes
90
having side-surface pattern formation portions as wall surfaces are first formed in an insulating substrate
92
, which is an upper layer of the electronic parts mounting substrate, as shown in FIG.
28
. The cut holes
90
are arranged in such a manner that they surround, in the form of a square, the peripheral edges of a mount opening portion formation portion
999
on the insulating substrate
92
.
Subsequently, a metal plating film
902
is coated on each wall surface of the cut holes
90
, and the band-like side-surface pads
903
, the wiring patterns
54
and the bonding pads
540
are formed on the upper surface of the insulating substrate
92
.
Then, cutting is performed between the wall surfaces of the respective cut holes
90
along dotted lines
900
shown in
FIG. 28
by router machining to form the mount opening portion
95
, and the plurality of side-surface patterns
901
are formed on the wall surfaces of the mount opening portion
95
.
Subsequently, another insulating substrate
91
is laminated and crimped on the bottom surface of the above mentioned insulating substrate
92
to obtain a multi-layer plate
98
. The through-holes
99
are formed in the peripheral edge of the multi-layer plate
98
, and their interiors are coated with the metal plating film
909
. Thereafter, a lead pin
86
is installed inside of each of the through-holes
99
. Accordingly, the electronic parts mounting substrate
9
shown in
FIG. 27
is obtained.
However, in the above-mentioned conventional electronic parts mounting substrate, there is a risk that the metal plating film
902
at the ends of each of the side-surface patterns
901
will peel off from the wall surface
919
of the mount opening portion
95
, as shown in FIG.
29
.
In other words, during router machining, the metal plating film
902
at each of the ends of the above side-surface patterns
901
covering on the wall surfaces
919
of the mount opening portion will be drawn and peeled off from the wall surfaces by the blade of the router machining tool. After the metal plating film
902
has been drawn and peeled off from the wall surfaces, the metal plating film
902
will further peel off from the portions of the wall surfaces from which the metal plating film
902
has already peeled off when there is a thermal shock, resulting in a risk that reliable electric conductivity of the side-surface patterns will be interrupted. Consequently, the router machining must be conducted gradually with high accuracy, and since the router machining rate cannot be increased, productivity is lowered.
Also, with the trend toward multiplying the functions of electronic parts in recent years, it has been required that side-surface patterns with various potentials be provided on the electronic parts mounting substrate
9
. Therefore, as shown in
FIG. 30
, it has been proposed that each of the wall surfaces of the mount opening portion
95
be punched at a predetermined portion to form a punched portion
912
, and the side-surface pattern
901
be formed between the respective punched portions
912
. With this process, side-surface patterns
901
having various potentials such as a power supply circuit P, a grounding circuit G or a signal circuit S can be formed. The side-surface patterns
901
can function as the power supply circuit P, the grounding circuit G or the signal circuit S. However, in this case as well, the end portion
902
of the side-surface pattern
901
may peel off when the mount opening portion
95
is punched.
The present invention has been made in view of the above problems with the prior art, and therefore an object of the present invention is to provide an electronic parts mounting substrate and a method of manufacturing the substrate, which are capable of preventing the side-surface pattern from peeling-off and facilitate the formation of the side-surface patterns having a plurality of potentials.
DISCLOSURE OF THE INVENTION
According to the present invention, the first means for solving the problems is directed to, as defined in the invention of claim
1
, an electronic parts mounting substrate having an insulating substrate in which a mount opening portion for mounting electronic parts thereat is formed, and side-surface patterns having a plurality of potentials and provided on the wall surfaces of said mount opening portion, characterized in that projection portions that project toward the interior of said mount opening portion from the side surfaces thereof are disposed at the mount opening portion, and the end portions of the respective side-surface patterns extend to the side surfaces of the projection portions.
The electronic parts mounting substrate according to the present invention has projection portions that project toward the interior of the mount opening portion from the wall surfaces thereof. The end portions of the respective side surfaces extend to the side surfaces of the projection portions. With this arrangement, even if an end portion of the side-surface pattern is peeled off, the peeling-off is restricted to only the end portion of the side-surface pattern that covers the side surface of the projection portion. Consequently, the side-surface pattern can be prevented from being peeled off from the wall surface of the mount opening portion.
Also, there is no risk that the side-surface pattern will be peeled off from the wall surface of the mount opening portion due to thermal shock. Therefore, the electric conductivity of the side-surface patterns can be ensured.
Also, as defined in the invention of claim
2
, it is preferable that the projection portion is designed such that the length between its base portion and an inside end portion is 0.1 to 0.5 mm. This enables the peeling-off of the side-surface pattern to be more effectively prevented. Also, there is no risk that the projection portion would become an obstacle when the electronic parts are mounted on the substrate. If the length is less than 0.1 mm, there is a risk that the side-surface pattern would be peeled off, while there is a risk that the projection portion would become an obstacle if the length exceeds 0.5 mm.
In the specification, the base portion of the above projection portion means a position on a straight line connecting a pair of corners which are boundaries between the side surface of the projection portion and the wall surface of the mount opening portion. Also, the inner end of the above mount opening portion means the inner surface of the mount opening portion which faces the interior of the mount opening portion, and no metal plating film is coated on the inn
Hayashi Teruo
Ishida Naoto
Tsukada Kiyotaka
Cuneo Kamand
Gaffin Jeffrey
Ibiden Co. Ltd.
Sughrue Mion Zinn Macpeak & Seas, PLLC
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