Substrate for mounting electronic part and electronic part

Details Substrate for mounting electronic part and electronic part Substrate for mounting electronic part and electronic part

2009-01-13

2010-11-30

Ngo, Hung V (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

With electrical device

C174S551000, C257S736000, C257S787000

Reexamination Certificate

active

07842889

ABSTRACT:
The present invention is characterized by a structure having a substrate1, and metallization layers2formed on the substrate1, on which a Sn solder film3and an Ag film4are formed. The Ag film4is a metal free from oxidization at room temperature in the atmosphere. In a wet process, since only an exposed side of the Sn solder film3is oxidized by the cell reaction of Ag and Sn, an upper surface of the Ag film4on the solder film, which would otherwise affect the connection, is not oxidized. Since the Ag film4melts into the Sn solder simultaneously with melting of the Sn solder film3, the Ag film4does not hinder the connection.

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Japanese Office Action of Application No. 2005-126080 dated Apr. 21, 2009.

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