Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate
2006-03-31
2010-10-05
Chu, Chris (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Outside periphery of package having specified shape or...
C257SE23001, C257S734000, C257S686000, C438S460000, C331S068000
Reexamination Certificate
active
07808104
ABSTRACT:
A recess (5a) in the corner direction and recesses (5b) in side directions are formed in each connecting pad (5A) located at a corner of a lower surface-side of an insulating base2having groove-shaped recesses (6) in the periphery, and groove-shaped recesses (6aand6b) in the corner and side directions are formed in each corner portion (2A) of the insulating base2corresponding to the connecting pad (5A). Connecting pads (5) of an electronic apparatus in which an electronic component is mounted on the insulating base2are mounted on an external electrical circuit board by using a solder. A solder (31) melted during the solder-mounting adheres onto the groove-shaped recesses (6aand6b) in the corner and side directions of the corner portion (2A) of the insulating base2and thus solder fillets are formed in the groove-shaped recesses (6aand6b). Thus, solder bonding strength in the corners where external force is likely to work can be increased and the connecting pads of the wiring board can be firmly bonded to the lead conductors of the external electrical circuit board by using a hard and brittle lead-free solder.
REFERENCES:
patent: 5931371 (1999-08-01), Pao et al.
patent: 6229404 (2001-05-01), Hatanaka
patent: 6441312 (2002-08-01), Tanimura et al.
patent: 2002/0089039 (2002-07-01), Wu
patent: 2007/0221711 (2007-09-01), Wada et al.
patent: 05-183103 (1993-07-01), None
patent: 05-259306 (1993-10-01), None
patent: 2003-068921 (2003-03-01), None
patent: 2004-047866 (2004-02-01), None
Chu Chris
Jiang Fang-Xing
Lerner David Littenberg Krumholz & Mentlik LLP
Sony Corporation
LandOfFree
Substrate for mounting electronic component and electronic... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Substrate for mounting electronic component and electronic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate for mounting electronic component and electronic... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4207959