Substrate for magnetic domain device

Details Substrate for magnetic domain device Substrate for magnetic domain device

1980-07-18

1983-03-22

Moffitt, James W.

Static information storage and retrieval

Magnetic bubbles

Disposition of elements

365 27, G11C 504, G11C 1908

Patent

active

043778542

ABSTRACT:
In a field-accessed magnetic domain device package assembly, the magnetic domain device carrier or support, the circuit line or conductor carrier, and the magnetic bias field source are integrally and coactively provided by a common substrate member. The member is a planar permanent magnetic insulator ceramic and carries a bonded conductor or wiring pattern. The input/output (I/O) terminals of the domain device, also referred to in the art as a chip, are selectively bonded to the conductors of the pattern thereby providing mechanical support of the chip directly to the substrate in a superimposed relationship, input/output electrical connection to the chip, and mounting of the chip in close proximity to the bias field source, the flux of which passes through the superimposed mounted chips to a high permeability member at least part of which is disposed on the opposite side of the chip.

REFERENCES:
patent: 4027298 (1977-05-01), Michaelis
patent: 4209848 (1980-06-01), Braun et al.
IBM Technical Disclosure Bulletin-vol. 18, No. 10, Mar. 1976, pp. 3184-3185.
IBM Technical Disclosure Bulletin-vol. 15, No. 5, Oct. 1972, p. 1602.

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