Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...
Reexamination Certificate
2003-04-11
2004-05-25
Toan, Minhloan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
In combination with or also constituting light responsive...
C257S678000, C257S688000, C257S099000, C257S080000
Reexamination Certificate
active
06740903
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to a substrate for a light emitting diode (LED) used in an electronic instrument such as a portable telephone.
In recent years, it is required that the substrate for the LED has a high heat radiation property, heat-resistant property and high mechanical strength in accordance with the tendencies of a high performance, multifunction, small size of the electronic instrument.
FIG. 15
is a perspective view showing a conventional substrate for an LED. The substrate comprises a metal base
51
made of copper or aluminum, an insulation layer
52
of prepreg adhered on the metal base
51
, circuit patterns
53
and
54
made of copper foil on which gold is plated. An LED
70
is mounted on the circuit pattern
53
and connected to the circuit pattern
54
by a wire
71
.
The metal base
51
has a high heat radiation property.
FIG. 16
is a perspective view of another conventional double face substrate. The substrate comprises a pair of metal bases
61
made of copper, an insulation member
63
between the metal bases
61
, insulation layers
62
of prepreg adhered to both sides of the metal bases
61
, circuit patterns
64
a
and
64
b
made of copper foil on which gold is plated. An LED
72
is mounted on the circuit pattern
64
a
and connected to the circuit pattern
64
b
by a wire.
In the substrate of
FIG. 15
, circuit patterns can not be provided on the underside of the metal base
51
. In the substrate of
FIG. 16
, since the insulation layer
62
is provided on the underside of the metal bases
61
, the heat radiation property is insufficient.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a substrate having a high heat radiation property.
According to the present invention, there is provided a substrate comprising a pair of metal bases, a first heat insulation layer disposed between the metal bases, a second heat insulation layer securely mounted on the metal bases, and mounting means for mounting an LED on the substrate.
The mounting means comprises a pair of circuit patterns securely mounted on the second heat insulation layer, the LED is securely mounted on both the circuit patterns.
In another aspect, the mounting means comprises a hole formed in the second heat insulation layer to expose surfaces of metal bases, the LED is securely mounted on both the metal bases.
The substrate further comprises upper and lower electrodes provided on an upper surface of the circuit patterns and on undersides of the metal bases.
One of the metal bases is different from the other metal base in size of a sectional shape.
These and other objects and features of the present invention will become more apparent from the following detailed description with reference to the accompanying drawings.
REFERENCES:
patent: 5298768 (1994-03-01), Okazaki et al.
patent: 5475241 (1995-12-01), Harrah et al.
patent: 6093940 (2000-07-01), Ishinaga et al.
patent: 2002/0139990 (2002-10-01), Suehiro et al.
Citizen Electronics Co. Ltd.
Dennison Schultz Dougherty & MacDonald
Greene Pershelle
Toan Minhloan
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