Substrate for high-frequency circuit and process for making the

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Composite having voids in a component

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156 77, 264 451, 4283177, 4283179, 4283191, 428461, B32B 310, B32B 314, B32B 516

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active

047511362

ABSTRACT:
A substrate for high-frequency circuits best suited as a substrate for a flat antenna to receive satellite-broadcast microwaves or as a similar substrate, the substrate comprising (i) a porous insulator layer wherein the proportion by volume of open cells to all the cells is at least 50% and (ii) a metal foil laminated over at least one side of the insulator layer through (iii) a water-impermeable film, and a process for making such substrates.

REFERENCES:
patent: 4212733 (1980-07-01), Goto et al.
patent: 4219602 (1980-08-01), Conklin
patent: 4221835 (1980-09-01), Severus-Laubenfeld
patent: 4647500 (1987-03-01), George et al.

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