Substrate for circuit wiring

Details Substrate for circuit wiring Substrate for circuit wiring

2006-07-18

2006-07-18

Gibson, Randy W. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

Reexamination Certificate

active

07078628

ABSTRACT:
The present invention concerns a substrate for circuit wiring in which an electronic component is mounted, by soldering, to a wiring pattern formed on an insulated layer deposited over a metallic substrate. A silica-based filler and a rubber-based filler are added in the insulated layer to reduce the linear thermal expansion of the layer and increase its elastic modulus. The mounting portion of an electronic component is molded with a resin material to which a silica-based filler has been added, and which thus has a coefficient of linear thermal expansion smaller than the coefficient of linear thermal expansion of the insulated layer. This serves to alleviate the stress caused by the linear thermal expansion of the metallic substrate, and thereby to prevent separation from occurring between the insulated layer and the metallic substrate, as well as between the insulated layer and the wiring pattern, when subjected to a high-temperature environment.

REFERENCES:
patent: 6201696 (2001-03-01), Shimizu et al.
patent: 6307749 (2001-10-01), Daanen et al.
patent: 6779260 (2004-08-01), Brandenburg et al.
patent: 2004/0084756 (2004-05-01), Kawakami et al.
patent: 5-129474 (1993-05-01), None
patent: 11008450 (1999-01-01), None

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