Substrate for circuit board including the glass fibers as reinfo

Details Substrate for circuit board including the glass fibers as reinfo Substrate for circuit board including the glass fibers as reinfo

1993-11-08

1994-08-02

Group, Karl

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524433, 501 35, 501 38, C08K 340, C03C 1302

Patent

active

053346459

ABSTRACT:
A glass fiber forming composition exhibits a remarkably high dielectric constant .epsilon..sub.r as well as superior chemical resistance, yet it is readily spun into glass fibers. The composition is characterized to show a devitrification temperature which is lower than a spinning temperature at which the glass composition exhibits a viscosity of 10.sup.2.5 poise, so as to be readily spun into corresponding glass fibers. The composition consists essentially of 40 to 65 mol % of SiO.sub.2 ; 20 to 45 mol % of at least one component selected from the group consisting of MgO, CaO, SrO and BaO; 5 to 25 mol % of at least one component selected from the group consisting of TiO.sub.2 and ZrO.sub.2 ; and 0.5 to 15 mol % of NbO.sub.5/2 as calculated from an incorporated amount of Nb.sub.2 O.sub.5. Alternately, the composition consist essentially of 40 to 65 mol % of SiO.sub.2 ; 20 to 45 mol % of at least one component selected from the group consisting of CaO, SrO and BaO; 5 to 25 mol % of at least one component selected from the group consisting of TiO.sub.2 and ZrO.sub.2 ; 0.5 to 15 mol % of NbO.sub.5/2 as calculated from an incorporated amount of Nb.sub.2 O.sub.5 ; and 0.5 to 15 mol % of AlO.sub.3/2 as calculated from an incorporated amount of Al.sub.2 O.sub.3. The composition is also characterized to incorporate at least 85 mol % of a total amount of the oxides and have a dielectric constant [.epsilon..sub.r ] of 9 or more at 1 MHz and 25.degree. C.

REFERENCES:
patent: 3060041 (1962-10-01), Loewenstein
patent: 4055435 (1977-10-01), Sagara
patent: 4179300 (1979-12-01), Sagara
patent: 4390638 (1983-06-01), Mennemann et al.
patent: 4400473 (1983-08-01), Mennemann et al.
patent: 4613647 (1986-09-01), Yonaiyama et al.
patent: 4830989 (1989-05-01), Trivedi et al.
patent: 5141976 (1992-08-01), Kohler et al.
patent: 5234982 (1993-08-01), Kircher et al.
Patent Abstracts of Japan, vol. 13, No. 461 (C-645) Oct. 18, 1989 & JP-A-01 179 741, Jul. 17, 1989.
Wold Patents Index Latest, Week 03, Derwent Publications Ltd., AN 90-096954 & JP-A-2 050 834, Feb. 20, 1990.

Affiliated with

Also associated with

Rating

Substrate for circuit board including the glass fibers as reinfo does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate for circuit board including the glass fibers as reinfo, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate for circuit board including the glass fibers as reinfo will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-65199