Etching a substrate: processes – Forming pattern using lift off technique
Reexamination Certificate
2006-05-09
2006-05-09
Hassanzadeh, Parviz (Department: 1763)
Etching a substrate: processes
Forming pattern using lift off technique
C216S044000, C430S312000, C430S313000, C430S314000
Reexamination Certificate
active
07041228
ABSTRACT:
A substrate comprising at least a first and a second coating layer on one surface of the substrate is for nanoimprint lithography, the first coating layer has a positive resist and the second coating layer has a negative resist. A process in connection with nanoimprint lithography on the substrate impresses a pattern of nanometer size in a first stage into the second coating layer by a template, following which the first coating layer, in a second stage, is exposed to a chiefly isotropic developing method on surfaces thereof that have been exposed in connection with the first stage, a method for developing and material for the first and second coating layers being selected so that the first coating layer is developed more quickly than the second coating layer, so that an undercut profile is obtained in the coating layers.
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Culbert Roberts
Hassanzadeh Parviz
Obducat Aktiebolag
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