Substrate for a semiconductor chip package and a method of fabri

Details Substrate for a semiconductor chip package and a method of fabri Substrate for a semiconductor chip package and a method of fabri

1985-09-30

1987-04-14

Swisher, Nancy

Stock material or miscellaneous articles

Circular sheet or circular blank

Recording medium or carrier

428192, 428901, 428902, B32B 516

Patent

active

046577971

ABSTRACT:
A substrate for a semiconductor chip package comprises a metal layer characterized by a high coefficient of thermal conductivity and girded by a restraining wrapper characterized by both a low coefficient of thermal expansion and a high ultimate tensile strength.

REFERENCES:
patent: 141812 (1873-08-01), Palmer
patent: 3491055 (1970-01-01), Talley
patent: 4234648 (1980-11-01), Patz et al.
patent: 4372347 (1983-02-01), Olson
patent: 4414264 (1983-11-01), Olson
patent: 4522667 (1985-06-01), Hanson et al.

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