Substrate for a microwave electronic circuit and a method for th

Details Substrate for a microwave electronic circuit and a method for th Substrate for a microwave electronic circuit and a method for th

1983-04-14

1984-04-03

Lesmes, George F.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Physical dimension specified

428698, 428427, 428433, H01M 620, H01M 216

Patent

active

044408285

ABSTRACT:
The substrate is formed by a plate of boron nitride having a composition of 42% B, 53.5% N.sub.2, containing between 1.5 and 2.5% O.sub.2, and 1.5% Ca. The surface is increased in hardness and made non-friable by deposition of a glass film to a depth within the range of 10 to 15 microns. This deposit permits surface metallization and ensures cohesion of the boron nitride grains.

REFERENCES:
patent: 3564565 (1971-02-01), Haberecht et al.
patent: 4096297 (1978-06-01), Pappis et al.
patent: 4360578 (1982-11-01), McCoy

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