Substrate for a microelectronic package and method of...

Details Substrate for a microelectronic package and method of... Substrate for a microelectronic package and method of...

2010-07-06

2011-12-06

Nguyen, Cuong Q (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S107000

Reexamination Certificate

active

08071424

ABSTRACT:
Substrates having molded dielectric layers and methods of fabricating such substrates are disclosed. The substrates may advantageously be used in microelectronic assemblies having high routing density.

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