Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2006-07-18
2006-07-18
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C439S055000
Reexamination Certificate
active
07078269
ABSTRACT:
An efficient substrate fabrication method is disclosed. A method of fabricating a substrate having a via terminal includes the steps of: forming a concave part on a front surface of a source substrate; forming a front surface side conductive part by filling the concave part with a conductor; forming the core substrate by back-grinding up to a position immediately before the front surface side conductive part is exposed such that a tip of the front surface side conductive part is covered with a portion of the core substrate; exposing the tip of the front surface side conductive part by forming a concave part in a rear surface of the core substrate; forming a rear surface side conductive part by filling the concave part with a conductor; and electrically and mechanically connecting the front surface side conductive part with the rear surface side conductive part.
REFERENCES:
patent: 6608371 (2003-08-01), Kurashima et al.
patent: 2004/0040739 (2004-03-01), Yoshimura et al.
patent: 2004/0212030 (2004-10-01), Asai
patent: 2001-053218 (2001-02-01), None
patent: 2001-274034 (2001-10-01), None
patent: 2002-008942 (2002-01-01), None
Rokugawa Akio
Yamasaki Tomoo
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