Substrate edge seal and clamp for low-pressure processing equipm

Details Substrate edge seal and clamp for low-pressure processing equipm Substrate edge seal and clamp for low-pressure processing equipm

1997-11-25

2000-06-13

Dang, Thi

Coating apparatus

Gas or vapor deposition

With treating means

156345, 156285, 118728, 118 52, 438618, C23C 1600

Patent

active

060735767

ABSTRACT:
A low-pressure processor for processing substrates includes a chuck that engages the substrates' peripheries for purposes of clamping, sealing, and centering the substrates on chuck bodies. For accomplishing all three purposes, a mechanical clamp can be arranged with two sealing regions. One of the sealing regions seals the clamp to a chuck body or an extension of the chuck body, and another of the sealing regions engages a peripheral edge surface of a substrate for sealing the clamp to the substrate. The second sealing region includes an inclined seating surface that engages a front edge of the substrate's peripheral edge surface and divides a clamping force into a first component that presses the substrate against the chuck body and a second component that centers the substrate on the chuck body. The peripheral engagement of the substrate exposes substantially the entire front surface of the substrate to processing and exposes substantially the entire back surface of the substrate to a heat-transfer gas for enhancing thermal transfers between the substrate and the temperature-regulated chuck body.

REFERENCES:
patent: 4194233 (1980-03-01), Jones et al.
patent: 4603466 (1986-08-01), Morley
patent: 4615755 (1986-10-01), Tracy et al.
patent: 5096536 (1992-03-01), Cathey, Jr.
patent: 5103367 (1992-04-01), Horowitz et al.
patent: 5180000 (1993-01-01), Wagner et al.
patent: 5213650 (1993-05-01), Wang et al.
patent: 5267607 (1993-12-01), Wada
patent: 5300175 (1994-04-01), Gardener et al.
patent: 5325261 (1994-06-01), Horowitz
patent: 5326725 (1994-07-01), Sherstinsky et al.
patent: 5343012 (1994-08-01), Hardy et al.
patent: 5382311 (1995-01-01), Ishikawa et al.
patent: 5383971 (1995-01-01), Selbrede
patent: 5660699 (1997-08-01), Saito et al.
patent: 5730804 (1998-03-01), Gomi et al.
patent: 5738751 (1998-04-01), Camerson
patent: 5739067 (1998-04-01), DeBusk et al.
patent: 5775416 (1998-07-01), Heimanson et al.
patent: 5804089 (1998-09-01), Suzuki et al.
patent: 5805408 (1998-09-01), Maraschin et al.
patent: 5861061 (1999-01-01), Hayes et al.
patent: 5936829 (1999-08-01), Moslehi

Affiliated with

Also associated with

Rating

Substrate edge seal and clamp for low-pressure processing equipm does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate edge seal and clamp for low-pressure processing equipm, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate edge seal and clamp for low-pressure processing equipm will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2060308