Substrate cutting method

Details Substrate cutting method Substrate cutting method

2006-07-18

2006-07-18

Dexter, Clark F. (Department: 3724)

Stone working

Sawing

Rotary

C083S056000, C083S365000, C083S368000, C083S821000, C438S011000, C438S018000, C438S462000

Reexamination Certificate

active

07077120

ABSTRACT:
A method of producing a semiconductor device constructed by arranging a plurality of substrates, on each of which, thin film semiconductor elements two-dimensionally arranged are installed. The method includes the steps of cutting a substrate along at least a slice line provided on the substrate and on a side facing another substrate, which is one of the substrates when the plurality of substrates are arranged, while detecting a misalignment of a cutting position from the slice line and correcting a cutting position, cutting the substrate of a side opposing the slice line without correcting the cutting position, and adjacently arranging the plurality of substrates on substantially a same plane such that the sides having been cut face each other, while correcting the cutting position of the substrates.

REFERENCES:
patent: 3276492 (1966-10-01), Kervefors
patent: 3398620 (1968-08-01), Gautron
patent: 3976384 (1976-08-01), Matthews et al.
patent: 4611517 (1986-09-01), Schmale
patent: 5059899 (1991-10-01), Farnworth et al.
patent: 5327353 (1994-07-01), Nagano
patent: 0660421 (1995-06-01), None

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