Substrate cooling

Details Substrate cooling Substrate cooling

1984-03-05

1985-05-28

Davis, Jr., Albert W.

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

16510423, 16510428, 417 50, 357 82, 361385, F28D 1500, H01L 2346

Patent

active

045194475

ABSTRACT:
A system for cooling a substrate via a continuous enclosed path within the substrate that passes closely adjacent heat producing components on or adjacent the substrate. According to a first embodiment, heat, where located on the substrate, is transmitted to a heat sink in the vapor phase by a change in phase of a liquid in the path to a vapor, thereby creating little change in temperature from heat source to heat sink and maintaining the substrate and components at substantially the same substantially constant temperature. According to a second embodiment, heat is removed by a circulating conductive liquid in the continuous enclosed path which takes up heat at the sources and removes the heat at a sink in the path. The conductive liquid is part of a magnetohydrodynamic (MHD) cooling system wherein, at one location in the path, a current is applied to the liquid orthogonal to the path and a magnetic field is applied orthogonal to the path and the current flow to create a force on the conductive liquid along the path.

REFERENCES:
patent: 2748356 (1956-05-01), Kaehni
patent: 3287677 (1966-11-01), Mohr
patent: 3327776 (1967-06-01), Butt
patent: 3812404 (1974-05-01), Barkan et al.
patent: 4037270 (1977-07-01), Ahmann et al.
patent: 4268850 (1981-05-01), Lazarek et al.
patent: 4327399 (1982-04-01), Sasaki et al.

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