Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...
Patent
1999-07-13
2000-05-02
Coe, Philip R.
Cleaning and liquid contact with solids
Processes
For metallic, siliceous, or calcareous basework, including...
134 61, 134 66, 134902, B08B 1300
Patent
active
060568283
ABSTRACT:
According to the present invention, there is provided a substrate conveying apparatus for loading/unloading a substrate to/from a processing section, including an arm for holding the substrate on an upper surface thereof, an arm drive mechanism for driving the arm such as to load/unload the substrate to/from the processing section, first and second suction members each having an opening communicating to a suction hole of the suction passage, for supporting the substrate by at least an edge portion of the opening, and a switching mechanism for selectively switching a mode between the support of the substrate by the first suction member and that by the second suction member.
REFERENCES:
patent: 3853313 (1974-12-01), Appenzeller et al.
patent: 4846626 (1989-07-01), Engelbrecht
patent: 5135349 (1992-08-01), Lorenz et al.
patent: 5177514 (1993-01-01), Ushijima et al.
patent: 5195862 (1993-03-01), Cruz
patent: 5310442 (1994-05-01), Ametani
patent: 5479108 (1995-12-01), Cheng
patent: 5518542 (1996-05-01), Matsukawa et al.
patent: 5553396 (1996-09-01), Kato et al.
patent: 5622400 (1997-04-01), George
patent: 5695817 (1997-12-01), Tateyama et al.
patent: 5842824 (1998-12-01), Nishi
patent: 5851296 (1998-12-01), Haraguchi et al.
Coe Philip R.
Tokyo Electron Limited
LandOfFree
Substrate conveying device and substrate conveying method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Substrate conveying device and substrate conveying method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate conveying device and substrate conveying method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1591225