Substrate contact electrode having refractory metal bump structu

Details Substrate contact electrode having refractory metal bump structu Substrate contact electrode having refractory metal bump structu

1995-03-15

1996-08-27

O'Shea, Sandra L.

Electric lamp and discharge devices

Electrode and shield structures

Composite electrodes or shields

257737, 257763, H01L 2900

Patent

active

055504272

ABSTRACT:
A fine substrate contact electrode (bump) made of a refractory metal having low resistance and sufficient mechanical strength is fabricated on a wiring substrate with a polyimide resin film serving as an electrically insulating layer. It is not the entire surface of the contact electrode that is covered with a high-resistance oxide film since the top surface of the refractory metal such as tungsten is covered with an oxidation-resistant metal film. The substrate contact electrode has a sufficient mechanical strength since the side of the tungsten bump is surrounded by a side wall reinforcement film even where the tungsten formed by the blanket chemical vapor deposition method is polycrystalline. Since the polyimide film is previously embedded before the substrate contact electrode is fabricated, the electrode can be formed on the polyimide film having a desired thickness on the entire substrate surface.

REFERENCES:
patent: 3942187 (1976-03-01), Gelsing et al.
patent: 4268849 (1981-05-01), Gray et al.
patent: 4951121 (1990-08-01), Furukawa et al.
patent: 5108950 (1992-04-01), Wakabayashi et al.
patent: 5134460 (1992-07-01), Brady et al.
patent: 5202579 (1993-04-01), Fujii et al.
"Tungsten Plug-In Wiring Structure For High Density Three Dimensional Devices", by K. Kajiyana et al., Jun. 11-12, 1991 VMIC Conference, IEEE. pp. 130-136.

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