Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing
Reexamination Certificate
2006-03-14
2006-03-14
Pert, Evan (Department: 2826)
Data processing: generic control systems or specific application
Specific application, apparatus or process
Product assembly or manufacturing
C700S110000, C700S121000
Reexamination Certificate
active
07013192
ABSTRACT:
A method of analyzing substrate yield, where a substrate yield map and a substrate contact map are selected and overlaid to produce a composite map. First elements of the substrate yield map are compared to second elements of the substrate contact map to determine a degree of correlation between the first elements and the second elements. Additional substrate contact maps are repeatedly selected and the first elements of the substrate yield map are compared to the second elements of the additional substrate contact maps, and a degree of correlation between the first elements and each of the second elements for the additional substrate contact maps is determined and reported. The composite map having a highest degree of correlation between the first elements and the second elements is presented, and all composite maps that have at least a desired degree of correlation between the first elements and the second elements are presented.
REFERENCES:
patent: 5787190 (1998-07-01), Peng et al.
patent: 5982920 (1999-11-01), Tobin et al.
patent: 6067507 (2000-05-01), Beffa
patent: 6185707 (2001-02-01), Smith et al.
patent: 6393602 (2002-05-01), Atchison et al.
patent: 6477685 (2002-11-01), Lovelace
patent: 6775630 (2004-08-01), Behkami et al.
patent: 2002/0121915 (2002-09-01), Montull et al.
patent: 2003/0229410 (2003-12-01), Smith et al.
patent: 2004/0162692 (2004-08-01), Ye et al.
patent: 2005/0060336 (2005-03-01), Aberoxombie et al.
patent: 2005/0132308 (2005-06-01), Whitefield et al.
Abarcrombie David A.
Whitefield Bruce J.
LSI Logic Corporation
Luedeka Neely & Graham P.C.
Pert Evan
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