Semiconductor device manufacturing: process – Having organic semiconductive component
Reexamination Certificate
2005-03-11
2008-12-02
Jackson, Jr., Jerome (Department: 2815)
Semiconductor device manufacturing: process
Having organic semiconductive component
C257S040000
Reexamination Certificate
active
07459338
ABSTRACT:
A substrate is provided which comprises an organic resin layer on a base material, wherein the base material has an average surface roughness of not less than 1.2 nm but no more than 5 nm and a maximum height of a surface unevenness of not less than 0.1 μm but no more than 1.0 μm; the organic resin layer has an average surface roughness of not more than 1 nm and a maximum peak height of a surface unevenness of not more than 30 nm; and at least a part of a surface of the organic resin layer comprises a hydrophilic region.
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C. D. Dimitrakopoulos, et al.; “Organic Thin Film Transistors for Large Area Electronics”, Advanced Materials, vol. 14, No. 2, Jan. 16, 2002, pp. 99-117.
Kubota Makoto
Miura Daisuke
Nakayama Tomonari
Ohnishi Toshinobu
Canon Kabushiki Kaisha
Fitzpatrick ,Cella, Harper & Scinto
Ho Anthony
Jackson, Jr. Jerome
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