Substrate comprising a lower silicone resin film and an...

Details Substrate comprising a lower silicone resin film and an... Substrate comprising a lower silicone resin film and an...

2011-01-11

2011-01-11

Pizarro, Marcos D. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C438S072000, C438S636000

Reexamination Certificate

active

07868407

ABSTRACT:
There is disclosed a substrate comprising at least an organic film, an antireflection silicone resin film over the organic film, and a photoresist film over the antireflection silicone resin film, wherein the antireflection silicone resin film includes a lower silicone resin film and an upper silicone resin film which has lower silicon content than the lower silicone resin film. There can be provided a substrate comprising at least an organic film, an antireflection silicone resin film over the organic film, and a photoresist film over the antireflection silicone resin film, in which the antireflection silicone resin film has both excellent resist compatibility and high etching resistance at the time of etching the organic film, whereby a pattern can be formed with higher precision.

REFERENCES:
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patent: 2004/0014322 (2004-01-01), Hwang et al.
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patent: A-07-183194 (1995-07-01), None
patent: A-2005-015779 (2005-01-01), None
Wikipedia, “silicone” Dec. 30, 2003, http://web.archive.org/web/20040111093510/http://en.wikipedia.org/wiki/silicone.
K. Linliu et al., “A Novel Dual Layer Polymeric Anti-Reflective Coating (PARC) for Sub-0.18 μm KrF Lithography”, Proceedings of SPIE, vol. 4000, (2000) pp. 982-993.

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