Cleaning and liquid contact with solids – Processes – With work or work parts movable during treatment
Reexamination Certificate
2005-04-19
2010-11-23
Carrillo, Sharidan (Department: 1711)
Cleaning and liquid contact with solids
Processes
With work or work parts movable during treatment
C134S018000, C134S021000, C134S025100, C134S025400, C134S026000, C134S030000, C134S031000, C134S032000, C134S034000, C134S036000, C134S037000, C134S042000, C134S902000, C034S060000, C034S222000, C034S443000, C034S487000, C034S488000
Reexamination Certificate
active
07837804
ABSTRACT:
In a dry process after a cleaning process using a cleaning-liquid nozzle and a rinse process using a side rinse nozzle are performed on a wafer W, the wafer W is turned, feeding of pure water to a center point of the wafer W from a pure-water nozzle is started, and substantially at the same, injection of a nitrogen gas from a gas nozzle to a center portion of the wafer W at a point at an adequate distance apart from the center of the wafer W is started. Next, while the pure-water nozzle is caused to scan toward the periphery of the wafer W, the gas nozzle is caused to scan toward the periphery of the wafer W in an area radially inward of the position of the pure-water nozzle after the gas nozzle passes the center of the wafer W.
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Office Action (Application No. 200580012831.X).
Ohno Hiroki
Sekiguchi Kenji
Carrillo Sharidan
Smith , Gambrell & Russell, LLP
Tokyo Electron Limited
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