Substrate cleaning method, substrate cleaning apparatus and...

Details Substrate cleaning method, substrate cleaning apparatus and... Substrate cleaning method, substrate cleaning apparatus and...

2011-04-19

2011-04-19

Barr, Michael (Department: 1714)

Cleaning and liquid contact with solids

Processes

With work or work parts movable during treatment

C134S094100

Reexamination Certificate

active

07927429

ABSTRACT:
After a rinse process on a wafer W is performed by feeding pure water to the surface of the wafer W at a predetermined flow rate while rotating the wafer W in an approximately horizontal state, a feed amount of the pure water to the wafer W is reduced, and a pure-water feed point is moved outward from the center of the wafer W. In this manner, the wafer W is subjected to a spin dry process while forming a liquid film in a substantially outer region of the pure-water feed point.

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Austrian Search Report, dated Apr. 23, 2007, in connection with PCT/JP2004/016842.

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