Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...
Reexamination Certificate
2008-06-12
2011-12-27
Kornakov, Michael (Department: 1714)
Cleaning and liquid contact with solids
Processes
Including application of electrical radiant or wave energy...
C134S001000
Reexamination Certificate
active
08083857
ABSTRACT:
The present invention provides a substrate cleaning method capable of reducing non-uniformity of a removal efficiency of particles between lots with a simple procedure. The substrate cleaning method comprises: a step of supplying a gas into a cleaning tank, while an irradiation of ultrasonic waves to the cleaning liquid in the cleaning tank is being stopped, so as to increase a dissolved gas concentration of the gas dissolved in the cleaning liquid in the cleaning tank to a saturated concentration; and a step of irradiating ultrasonic waves to the cleaning liquid in the cleaning tank so as to clean a substrate immersed in the cleaning liquid in the cleaning tank. In the step of increasing the dissolved gas concentration to the saturated concentration, the gas is supplied to the cleaning tank so as to increase the dissolved gas concentration of the cleaning liquid in the cleaning tank to the saturated concentration. In addition, in the step of increasing the dissolved gas concentration to the saturated concentration, the irradiation of the ultrasonic waves to the cleaning liquid in the cleaning tank is stopped.
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The Aqueous Cleaning Handbook, Third Ed., 2002, p. 18.
English Machine Translation of JP 10-109072A.
Japanese Office Action issued on Jul. 29, 2011 for Application No. 2007-340412 w/ English language translation.
Eshima Kazuyoshi
Shindo Naoki
Watanabe Tsukasa
Blan Nicole
Kornakov Michael
Smith , Gambrell & Russell, LLP
Tokyo Electron Limited
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