Cleaning and liquid contact with solids – Processes – Combined
Reexamination Certificate
2007-08-14
2007-08-14
Kornakov, M. (Department: 1746)
Cleaning and liquid contact with solids
Processes
Combined
C134S002000, C134S003000, C134S025400, C134S042000, C436S050000, C438S906000
Reexamination Certificate
active
10937014
ABSTRACT:
In a cleaning treatment of a substrate using an aqueous solution of ammonium fluoride or a mixture of an aqueous solution of ammonium fluoride and hydrofluoric acid as a cleaning liquid, the cleaning liquid is replenished by at least one liquid selected from the group consisting of water, ammonia, aqueous ammonia, and an aqueous solution of ammonium fluoride with the lapse of time during the use of the cleaning liquid, in which the required amount of the liquid to be added according to the time lapse is calculated based on the measurement date and controlled, or the component concentration of the cleaning liquid is detected and the liquid is added according to the obtained result, so that not only can the substrate be cleaned uniformly and stably, but also a resource saving and a reduction in waste can be achieved.
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Kashkoush et al., “In-Situ Chemical Concentration Control for Wafer Wet Cleaning,” Journal of the IEST, May/Jun. 1998, pp. 24-30.
Fujitani Yoshihiro
Inagaki Yasuhito
Shimizu Mineo
Kornakov M.
Sonnenschein Nath & Rosenthal LLP
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