Substrate cleaning method and cleaning apparatus

Details Substrate cleaning method and cleaning apparatus Substrate cleaning method and cleaning apparatus

2006-07-18

2006-07-18

Kornakov, M. (Department: 1746)

Cleaning and liquid contact with solids

Processes

With work or work parts movable during treatment

C134S001000, C134S001300, C134S032000, C134S034000, C134S184000, C134S187000, C134S198000, C438S906000

Reexamination Certificate

active

07077916

ABSTRACT:
A substrate is cleaned by supplying an ultrasonically-agitated cleaning liquid onto the substrate from a nozzle provided above the substrate while spinning the substrate. The substrate being cleaned is spun at a rotational speed of 2600 rpm or more and 3500 rpm or less, or at a rotational speed of 260×V/D (rpm) or more and 350×V/D (rpm) or less, where D (mm) is a diameter of the nozzle and V (mm/sec) is a moving velocity of the nozzle.

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