Substrate cleaning apparatus and substrate cleaning method

Details Substrate cleaning apparatus and substrate cleaning method Substrate cleaning apparatus and substrate cleaning method

2006-10-27

2011-11-29

Kornakov, Michael (Department: 1714)

Cleaning and liquid contact with solids

Apparatus

With heating, cooling or heat exchange means

C134S110000, C134S111000

Reexamination Certificate

active

08066020

ABSTRACT:
A substrate cleaning apparatus, comprises a process tank that holds a mixture containing a hydrogen peroxide solution and sulfuric acid and is used for cleaning a substrate immersed in said mixture; circulation piping that extends between a primary side of said process tank on which said mixture is injected into said process tank and a secondary side of said process tank on which said mixture is discharged from said process tank and has a pump for causing circulation of said mixture; a heater disposed in said circulation piping configured to heat said mixture to a predetermined temperature; a chemical injection pipe configured to inject a hydrogen peroxide solution into said circulation piping at a position between the primary side of said process tank and a secondary side, which is a downstream side, of said heater; and a filter disposed in said circulation piping configured to remove particles in said mixture.

REFERENCES:
patent: 6055995 (2000-05-01), Miyazawa
patent: 6221167 (2001-04-01), Karasawa
patent: 6584989 (2003-07-01), Taft et al.
patent: 6-342780 (1994-12-01), None
patent: 2000-164550 (2000-06-01), None
patent: 2000-228386 (2000-08-01), None
patent: 2002-96012 (2002-04-01), None
patent: 2002-110605 (2002-04-01), None
JPO translation of JP 2002-096012 to Muraoka et al. retrieved Jan. 29, 2011.
Notification of Reasons for Rejection issued by the Japanese Patent Office of May 7, 2010, for Japanese Patent Application No. 2005-318292, and English-language translation thereof.

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