Cleaning and liquid contact with solids – Processes – Using sequentially applied treating agents
Reexamination Certificate
2008-01-01
2008-01-01
El-Arini, Zeinab (Department: 1746)
Cleaning and liquid contact with solids
Processes
Using sequentially applied treating agents
C134S002000, C134S003000, C134S028000, C134S029000, C134S033000, C134S036000, C134S037000, C134S094100, C134S095300, C134S095100, C134S098100, C134S099100, C134S102100, C134S102200, C134S103200
Reexamination Certificate
active
07314529
ABSTRACT:
A soft spray nozzle discharging a cleaning mist is vertically directed and fixed to an arm. A rinse nozzle discharging rinsing deionized water for suppressing obstruction is vertically fixed to the arm at a prescribed distance from the soft spray nozzle. During cleaning, it follows that both nozzles discharge detergents while keeping relative layout relation. Therefore, the discharged cleaning mist and rinsing deionized water do not interfere with each other before reaching the substrate but the used detergents are entirely horizontally splashed and recovered in a cup. Thus, the cleaning mist is prevented from scattering and adhering to the periphery.
REFERENCES:
patent: 5964952 (1999-10-01), Kunze-Concewitz
patent: 6247479 (2001-06-01), Taniyama et al.
patent: 6367490 (2002-04-01), Namba
patent: 6858091 (2005-02-01), Boyd et al.
patent: 7017281 (2006-03-01), Izumi
patent: 2002/0035762 (2002-03-01), Okuda et al.
patent: 2003-0036087 (2003-05-01), None
Hashizume Akio
Nakajima Kazuo
Sato Masanobu
Sugimoto Hiroaki
Tsujikawa Hiroki
Dainippon Screen Mfg. Co,. Ltd.
El-Arini Zeinab
Ostrolenk Faber Gerb & Soffen, LLP
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