Substrate clamp design for minimizing substrate to clamp stickin

Details Substrate clamp design for minimizing substrate to clamp stickin Substrate clamp design for minimizing substrate to clamp stickin

1997-01-13

1998-12-01

Nguyen, Nam

Coating processes

Electrical product produced

Metal coating

4272481, 427250, 4272556, 427 99, 438680, 438760, 20419215, 20419217, 20419222, B05D 512, C23C 1434, H01L 21324

Patent

active

058435204

ABSTRACT:
A clamp for fixturing a substrate when forming and thermally processing upon the substrate a thermally flowable layer. The clamp comprises a backing member having a top member connected through a first mechanical means to the backing member. The backing member and the top member are sized such that a substrate may be clamped between the backing member and the top member. A portion of the top member overlaps the substrate and leaves exposed a first portion of the substrate when the substrate is clamped between the backing member and the top member. The clamp also comprises a shroud connected through a second mechanical means to the backing member, where a portion of the shroud overlaps the top member. The shroud leaves exposed a second portion of the substrate which is smaller than and contained within the first portion of the substrate. The shroud is removable from the backing member while the substrate remains clamped between the backing member and the top member.

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patent: 4836905 (1989-06-01), Daris et al.
patent: 5534110 (1996-07-01), Lenz et al.
S. Wolf et al, "Silicon Processing for the VLSJ Era-vol. 1" Lattice Press. Sunset Beach, CA, 1986, pp. 359-363.
Ono et al, "Development of a Planarized Al-Si Contact Filing Technology" 1990 VMIC Conf. Proceedings (Jun. 12-13, 1990) pp. 76-82.
Chen et al. "Planarized Aluminum Metallization for sub 0.5 micron CMOS Technology" IEEE IEDM 90. pp. 90-51 to 90-53, 1990.
Park et al. "Al-PLAPH (Aluminum PLanarization by Post Heating) Process for Planarized Double Metal CMOS Applications" VMIC Conf. Proceedingsg. pp. 326-328, Jun. 1991.

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