Substrate bonding method and electronic component thereof

Details Substrate bonding method and electronic component thereof Substrate bonding method and electronic component thereof

2009-07-14

2011-11-01

Lindsay, Jr., Walter L (Department: 2812)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

C438S455000, C257SE21211

Reexamination Certificate

active

08048772

ABSTRACT:
A substrate bonding method has a film forming step of forming an insulating film for bonding in such a manner that an SiO2film made of TEOS is deposited on at least one of a first substrate and a second substrate by a CVD method, and a bonding step of bonding the first substrate and the second substrate with the insulating film for bonding being interposed between the first substrate and the second substrate.

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English abstract of CN1582072A published on Feb. 16, 2005, 1 page.
English abstract of CN101023517A published on Aug. 22, 2007, 1 page.
Chinese Office Action issued in Chinese Application No. 2009101599812.X issued on Apr. 28, 2011 and English translation thereof, 11 pages.

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