Substrate board having an anti-adhesive solder mask

Details Substrate board having an anti-adhesive solder mask Substrate board having an anti-adhesive solder mask

1996-08-26

1998-08-18

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174256, 174258, 174259, 174260, 257723, H05K 103

Patent

active

057965862

ABSTRACT:
Discloses is a method for making substrate boards for use in packaging semiconductor devices. The substrate board has a plurality of conductive traces patterned on at least one side, and an anti-adhesive solder mask is applied over and around conductive traces lying at an outer portion of the substrate board. The center portion of the substrate board will therefore remain uncovered by the anti-adhesive solder mask material. As a result, the uncovered center portion of the substrate board and conductive traces provide a surface area that is substantially more adhesive than the outer portion covered with the anti-adhesive solder mask.

REFERENCES:
patent: 5216278 (1993-06-01), Lin et al.
patent: 5436203 (1995-07-01), Lin
patent: 5457341 (1995-10-01), West

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