Semiconductor device manufacturing: process – Semiconductor substrate dicing – With attachment to temporary support or carrier
Reexamination Certificate
2007-09-11
2007-09-11
Schillinger, Laura M. (Department: 2813)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
With attachment to temporary support or carrier
C438S459000, C438S460000, C428S343000
Reexamination Certificate
active
11001575
ABSTRACT:
A method for attaching a substrate such as a semiconductor wafer in which cracking or chipping can be prevented when the substrate is thinned involves applying adhesive liquid onto a circuit (element)-formed surface of a semiconductor wafer. The adhesive liquid undergoes preliminary drying, so that its flowability is reduced and it can keep its shape as an adhesive layer. For the preliminary drying, heating is conducted for 5 minutes at a temperature of 80° C. by using an oven. The thickness of the adhesive layer is determined based on the irregularities of the circuit which has been formed on the surface of the semiconductor wafer. Next, a supporting plate is attached to the semiconductor wafer on which the adhesive layer of a desired thickness has been formed.
REFERENCES:
patent: 6404643 (2002-06-01), Chung
patent: 6886246 (2005-05-01), Chung
patent: 2002/0124392 (2002-09-01), Chung
patent: 2001-077304 (2001-03-01), None
patent: 2002-203821 (2002-07-01), None
patent: 2002-270676 (2002-09-01), None
Doi Kosuke
Inao Yoshihiro
Misumi Koichi
Miyagi Ken
Miyanari Atsushi
Blackman William D.
Carrier Joseph P.
Carrier, Blackman & Assoc. P.C.
Schillinger Laura M.
Tokyo Ohka Kogyo Co. Ltd.
LandOfFree
Substrate attaching method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Substrate attaching method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate attaching method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3745284