Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-03-11
1999-05-25
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361749, 174 522, 174260, 257679, 257787, 29841, 235491, 343702, H01L 2331, H05K 702
Patent
active
059074779
ABSTRACT:
An enclosed electrical circuit and method for manufacturing the electrical circuit are provided. Initially a flexible substrate is formed with a plurality of electrical circuits. By way of example, each circuit can contain a conductive trace, a battery and a die, all in electrical communication. During the manufacturing process, a barrier is placed on the substrate and a curable encapsulant is poured into a cavity formed by the barrier and the substrate to encapsulate each circuit. The barrier can be formed as a compartmentalized dam having a separate cavity for each circuit, as a perimeter dam having a single cavity, or as a spacer sheet having a separate cavity for each circuit formed by a pattern of cut outs. Following the encapsulation step, the electrical circuits can be singulated into separate encapsulated circuits.
REFERENCES:
patent: 4218701 (1980-08-01), Shirasaki
patent: 4502903 (1985-03-01), Bruder
patent: 4621035 (1986-11-01), Bruder
patent: 4814943 (1989-03-01), Okuaki et al.
patent: 4903169 (1990-02-01), Kitagawa et al.
patent: 5018005 (1991-05-01), Lin et al.
patent: 5136365 (1992-08-01), Pennisi et al.
patent: 5295044 (1994-03-01), Araki et al.
patent: 5321240 (1994-06-01), Takahira
patent: 5327010 (1994-07-01), Uenaka et al.
patent: 5336931 (1994-08-01), Juskey et al.
patent: 5350645 (1994-09-01), Lake et al.
patent: 5362652 (1994-11-01), Lake
patent: 5386342 (1995-01-01), Rostoker
patent: 5389738 (1995-02-01), Piosenka et al.
patent: 5416358 (1995-05-01), Ochi et al.
patent: 5422514 (1995-06-01), Griswold et al.
patent: 5477047 (1995-12-01), Nakagawa et al.
patent: 5528222 (1996-06-01), Moskowitz et al.
patent: 5536466 (1996-07-01), Ogawa et al.
patent: 5558679 (1996-09-01), Tuttle
patent: 5601941 (1997-02-01), Tuttle
patent: 5605547 (1997-02-01), Lake
patent: 5612513 (1997-03-01), Tuttle et al.
patent: 5646828 (1997-07-01), Degani et al.
patent: 5866441 (1999-02-01), Pace
Cirino Clay L.
Lake Rickie C.
Mousseau Joe P.
Tuttle Mark E.
Gratton Stephen A.
Micron Communications Inc.
Picard Leo P.
Vigushin John B.
LandOfFree
Substrate assembly including a compartmental dam for use in the does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Substrate assembly including a compartmental dam for use in the , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate assembly including a compartmental dam for use in the will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-404981