Substrate assembly apparatus and substrate assembly method

Details Substrate assembly apparatus and substrate assembly method Substrate assembly apparatus and substrate assembly method

2006-05-25

2010-10-26

Goff, John L (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Chamber enclosing work during bonding and/or assembly

C156S580000

Reexamination Certificate

active

07819159

ABSTRACT:
A bonding apparatus, suitable for accurately bonding large substrates for a liquid crystal display, includes Z-axis drive mechanisms, and upper and lower chambers. The Z-axis drive mechanisms for moving an upper frame vertically are disposed at four corners of a mount. The upper chamber is supported by the upper frame and has an upper table inside. The lower chamber has a lower table inside and is supported on the mount. The upper and lower chambers are united through a seal ring to define a vacuum chamber. Moving the upper frame moves the upper chamber vertically to open or close the vacuum chamber. The lower table is supported via a free joint stage between the plurality of support legs and the table, and is moved horizontally by a side thrust mechanism disposed outside of the vacuum chamber.

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patent: 2004/0095548 (2004-05-01), Lim et al.
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patent: 2004-233473 (2004-08-01), None
Machine translation for JP 2004-233473 Aug. 2009.

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