Substrate assembling apparatus and substrate assembling...

Details Substrate assembling apparatus and substrate assembling... Substrate assembling apparatus and substrate assembling...

2007-05-15

2010-12-14

Nguyen, Khanh (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S286000, C156S287000, C156S060000, C156S381000, C156S382000, C156S104000

Reexamination Certificate

active

07850815

ABSTRACT:
A technique which solves the problem of conventional laminating apparatuses that a substrate may be deformed when released by pushing lift pins against the substrate held on an adhesive member by suction. An upper table inside a chamber has, on its substrate holding face, an elastic plate provided with an elastic body, a vacuum suction means and a purge gas blow means. A plurality of adhesive pins are provided on an adhesive pin plate which can move up and down independently from the upper table. The upper table and the elastic plate have through holes through which the adhesive pins can move and the adhesive pins have adhesion means at their tips.

REFERENCES:
patent: 3818823 (1974-06-01), Bond
patent: 4661141 (1987-04-01), Nitschke et al.
patent: 2004/0047993 (2004-03-01), Kumar et al.
patent: 2005-351961 (2005-12-01), None

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