Substrate and method of separating components from a substrate

Details Substrate and method of separating components from a substrate Substrate and method of separating components from a substrate

2006-11-14

2006-11-14

Peterson, Kenneth E. (Department: 3724)

Severing by tearing or breaking

Methods

With preliminary weakening

C225S096000, C438S462000

Reexamination Certificate

active

07134582

ABSTRACT:
A substrate (1) having a first groove (4) is provided with a protrusion (3) on the first groove (4). This protrusion (4) preferably has a top with an apex angle of 30 to 150 degrees and results in a controlled breaking of the substrate (1) and a minimum of loss due to deviations of the crack initiated at the protrusion (4).

REFERENCES:
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patent: 5132252 (1992-07-01), Shiraiwa et al.
patent: 5496777 (1996-03-01), Moriyama
patent: 5786266 (1998-07-01), Boruta
patent: 6114072 (2000-09-01), Narimatsu
patent: 6218263 (2001-04-01), Chung et al.
patent: 2-36094 (1990-02-01), None

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