Substrate and method of forming substrate for fluid ejection...

Details Substrate and method of forming substrate for fluid ejection... Substrate and method of forming substrate for fluid ejection...

2006-09-12

2006-09-12

Alanko, Anita (Department: 1765)

Etching a substrate: processes

Forming or treating thermal ink jet article

C216S002000, C216S041000, C216S049000, C216S099000

Reexamination Certificate

active

07105097

ABSTRACT:
A method of forming an opening through a substrate includes etching into the substrate from a first side so as to form a first portion of the opening, etching into the substrate from a second side opposite the first side so as to form a second portion of the opening, continuing etching into the substrate from at least one of the first side and the second side toward the other of the first side and the second side so as to communicate the first portion and the second portion of the opening, and etching into the substrate from an interface between the first portion and the second portion of the opening, including etching toward the second side of the substrate and forming a third portion of the opening.

REFERENCES:
patent: 4601777 (1986-07-01), Hawkins et al.
patent: 4808260 (1989-02-01), Sickafus et al.
patent: 5317346 (1994-05-01), Garcia
patent: 5608436 (1997-03-01), Baughman et al.
patent: 5871656 (1999-02-01), Silverbrook
patent: 5971527 (1999-10-01), Peeters et al.
patent: 6107209 (2000-08-01), Ohkuma
patent: 6132034 (2000-10-01), Miller
patent: 2001/0024222 (2001-09-01), Ohno et al.
patent: 2002/0118253 (2002-08-01), Ohno et al.
patent: 0430593 (1991-06-01), None
patent: 0841167 (1998-05-01), None
patent: 1038676 (2000-09-01), None
patent: 1138491 (2001-10-01), None
patent: 1138491 (2001-10-01), None
patent: 4-312853 (1992-11-01), None
patent: 2000255069 (1999-03-01), None
UK Search Reportfor United Kingdom Patent Application No. 0301946.0 mailed on Mar. 13, 2003.

Affiliated with

Also associated with

Rating

Substrate and method of forming substrate for fluid ejection... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate and method of forming substrate for fluid ejection..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate and method of forming substrate for fluid ejection... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3604961