Incremental printing of symbolic information – Ink jet – Ejector mechanism
Reexamination Certificate
2006-03-28
2006-03-28
Pham, Hai (Department: 2861)
Incremental printing of symbolic information
Ink jet
Ejector mechanism
C347S063000
Reexamination Certificate
active
07018015
ABSTRACT:
A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming a trench in the first side of the substrate, forming a mask layer within the trench, forming at least one hole in the mask layer, filling the trench and the at least one hole, forming a first portion of the opening in the substrate from the second side of the substrate to the mask layer, and forming a second portion of the opening in the substrate from the second side of the substrate through the at least one hole in the mask layer to the first side of the substrate.
REFERENCES:
patent: 4894664 (1990-01-01), Tsung Pan
patent: 5124717 (1992-06-01), Campanelli et al.
patent: 5141596 (1992-08-01), Hawkins et al.
patent: 5387314 (1995-02-01), Baughman et al.
patent: 5513431 (1996-05-01), Ohno et al.
patent: 5870123 (1999-02-01), Lorenze, Jr. et al.
patent: 5871656 (1999-02-01), Silverbrook
patent: 6000787 (1999-12-01), Weber et al.
patent: 6008138 (1999-12-01), Laermer et al.
patent: 6045710 (2000-04-01), Silverbrook
patent: 6096656 (2000-08-01), Matzke et al.
patent: 6107209 (2000-08-01), Ohkuma
patent: 6139761 (2000-10-01), Ohkuma
patent: 6234608 (2001-05-01), Genovese et al.
patent: 6305080 (2001-10-01), Komuro et al.
patent: 6474794 (2002-11-01), Anagnostopoulos et al.
patent: 6474795 (2002-11-01), Lebens et al.
patent: 6475402 (2002-11-01), Nordstrom et al.
patent: 0841167 (1998-05-01), None
patent: 0886307 (1998-12-01), None
patent: 0978832 (2000-02-01), None
patent: 2245366 (1992-01-01), None
patent: WO 00/23376 (2000-04-01), None
Haluzak Charles C.
Monroe Michael
Truninger Martha A.
Hewlett--Packard Development Company, L.P.
Pham Hai
LandOfFree
Substrate and method of forming substrate for fluid ejection... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Substrate and method of forming substrate for fluid ejection..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate and method of forming substrate for fluid ejection... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3541940