Substrate and manufacturing method of the same, and...

Details Substrate and manufacturing method of the same, and... Substrate and manufacturing method of the same, and...

2011-01-25

2011-01-25

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Miscellaneous

C257S797000, C438S401000

Reexamination Certificate

active

07875988

ABSTRACT:
A substrate for fixing an integrated circuit element includes: a plurality of metal columns that are aligned in a longitudinal direction and a lateral direction in a planar view, each of the plurality of metal columns having a first face and a second face facing opposite direction to the first face; and a connecting part that connects the plurality of metal columns one another at a part of each of the plurality of metal columns between the first face and the second face. In the substrate, a recognition mark is formed on the first face of one of the plurality of metal columns.

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patent: 2008/0284048 (2008-11-01), Kim et al.
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patent: A 2-240940 (1990-09-01), None
patent: A 2004-281486 (2004-10-01), None
patent: A 2005-322704 (2005-11-01), None

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