Substrate and manufacturing method of package structure

Details Substrate and manufacturing method of package structure Substrate and manufacturing method of package structure

2007-04-23

2011-11-01

Loke, Steven (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C438S107000

Reexamination Certificate

active

08049337

ABSTRACT:
A substrate board and a manufacturing method of a package structure are provided. The substrate board includes a first surface, a die-attaching area, a cutting area, a plurality of first pads and a first solder mask. The die-attaching area for attaching a die is located on the first surface. The first pads are disposed on the first surface. The first solder mask is partially disposed on the first surface to expose part of the cutting area and the first pads. The first solder mask is divided into a first inner area and a first outer area via the cutting area. The die-attaching area and the first pads are located in the first inner area. Wherein, part of the first mask is located on the cutting area for connecting the first inner area and the first outer area.

REFERENCES:
patent: 6291260 (2001-09-01), Huang et al.
patent: 6389689 (2002-05-01), Heo
patent: 7091583 (2006-08-01), Chen et al.
patent: 2006/0091533 (2006-05-01), Huang et al.

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