Substrate and ceramic package

Details Substrate and ceramic package Substrate and ceramic package

1994-04-05

1996-05-21

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174250, 361748, 361794, H05K 114

Patent

active

055191762

ABSTRACT:
A substrate or a ceramic package for packaging semiconductor chips, which comprises an insulating layer having a signal line on one surface of said insulating layer and a power line or ground line corresponding to said signal line on the other surface of said insulating layer. A well-controlled constant high frequency characteristics, and particularly, characteristic impedance, can be obtained on the signal line without being influenced by the power line or ground line.

REFERENCES:
patent: 5028473 (1991-07-01), Vitriol et al.
patent: 5231751 (1993-08-01), Sachdev et al.
patent: 5329695 (1994-07-01), Traskos et al.
patent: 5348792 (1994-09-01), Hattori et al.

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